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RFID electronic tag packaging equipment

Company Products Products Wafer Test Probe Station The electronic tag packaging machine is a key equipment for producing radio frequency electronic tags. It is a high-tech equipment involving multiple technical fields such as optics, precision machinery, automatic control, and machine vision. The electronic tag inverted packaging machine consists of a feeding unit, a dispensing unit, a chip picking unit, a die bonding unit, a detection unit, and a receiving unit. Its overall technical indicators are as follows: Output 8000UPH Finished product qualification rate ≥99.7% Chip packaging error ±50μm Wafer size 8" Chip specifications 0.3mm×0.3 mm ~ 3.0mm ×3.0 mm Antenna tape width ≤460mm Heating temperature ≤200℃ Adhesive ACP, NCP Dispensing method Dispensing Antenna material Paper-based copper foil, aluminum foil antennas, and printed antennas (roll-to-roll).

Detailed introduction

RFID Electronic Tag Encapsulation Equipment

RFID radio frequency identification technology is a non-contact automatic identification technology with many advantages. With the continuous improvement and maturity of China's RFID application technology and the continuous reduction of manufacturing costs, its products have increasingly broad application prospects in various industries.

RFID electronic tag encapsulation equipment is one of the important components of the RFID technology industry chain. The equipment is a high-tech advanced manufacturing equipment integrating optics, precision machinery, and automatic control technologies. The equipment adopts an inverted encapsulation technology to encapsulate various high-frequency antennas and ultra-high-frequency antennas, realizing interconnection between the chip and the antenna.

Equipment Technical Parameters:

● Antenna flexible substrate material: various polymer materials (PET, paper, PP, PVC);

● Antenna flexible substrate width: 35 mm~180 mm;

● Antenna thickness: 35μm~100μm;

● Minimum antenna spacing: 26mm;

● Wafer size: 12";

● Chip packaging accuracy: ±25μm;

● Chip specifications: 0.3 mm 0.3 mm ~ 1.5mm 1.5 mm;

● Chip thickness: ≥100μm;

● Adhesive: ACP, NCP;

● Adhesive method: Spray adhesive;

● Temperature control: Up to 200 degrees;

● Temperature control accuracy: ±5 degrees;

● Hot press head pressure control: 49g ~ 1250g;

● Hot press head pressure control accuracy: ±5 g;

● Production efficiency: 20000UPH;

● Pass rate: ≥99.5%;

● Equipment dimensions: Length x Width x Height = 6.5m x 1.5m x 1.8m;

● Equipment weight: 3000Kg.

The equipment consists of five parts: feeding module, spray adhesive and chip bonding module, hot pressing module, detection and material receiving module, and operation platform module.

 

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  RFID electronic tag encapsulation equipment is characterized by high speed, high precision, high flexibility, good stability, strong interchangeability, low maintenance cost, and strong operability. It is a high-end equipment with numerous patented technologies.

  In recent years, with the development of large-scale integrated circuits, network communication, and information security, RFID technology has entered the commercial application stage abroad.

  Currently, RFID electronic tags have been widely used in weapon logistics management, supply chain management, item tracking, airline baggage sorting, factory assembly lines, vehicle anti-theft, electronic tickets, animal management, and product anti-counterfeiting.

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