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Infrared laser scribing machine

The AS113S series laser scribing machine is a dedicated device in the 0201 chip resistor manufacturing process. It is suitable for the scribing process of small-sized ceramic substrates, and achieves efficient and stable fully automatic scribing through a high-precision linear positioning platform and a high-power laser.

Detailed introduction

The AS113S series laser scribing machine is a dedicated device in the 0201 chip resistor process. It is suitable for the scribing process of small-sized ceramic substrates, and achieves efficient and stable fully automatic scribing through a high-precision linear positioning platform and a high-power laser.
This equipment has a high-precision vision alignment system. Top and bottom cameras enable scribing on both the front and back sides, ensuring the alignment of the scribed lines on both sides.

1. Main Indicators

Working Range

X/Y Axis Travel

mm

250/200

Substrate Size

mm

80*80 (optional)

Scribing Parameters

Scribing Speed

mm/s

400

Scribing Depth

μm

20-150

Optical System

Spot Size

μm

20

Laser Wavelength

nm

1070

Laser Power

w

100

Focusing Accuracy

μm

<2

Worktable

Positioning Accuracy

μm

<1.5

Rotation Accuracy

1

Vision System

Image System

 

Dual CCD System

Control System

PCI Card

 

8-axis High-speed Control Card

Mechanical Parameters

Length/Width/Height

m

1.3/1.1/1.5

Equipment Weight

kg

980

2. Product Features

Main Parameters

Performance Description

Remarks

Scribing Quality

For 0201 scribing, the I-grade and II-grade scribe groove morphology conforms to a 1:1 ratio of vaporization layer and hot melt layer depth; depth, width, etc., must meet technical requirements; the chip breakage rate after scribing <0.1%;
Disconnection rate <0.6%; the scribe groove cross-section is free of fragmentation.

See Appendix 1

Scribing Process

1. Crater height is adjustable from 0-4μm.

2. The crater presents a groove morphology, with a groove depth >3μm.

Production Capacity

Taking the 0201 model as an example, the continuous production capacity for completing front and back scribing is no less than 380 pieces/day.

 

Precision

1. The overall scribing accuracy of the machine is less than ±5μm.

2. The pitch value error is less than ±0.5μm.

3. The alignment after scribing ≤5μm.

 

Component Selection

1. Uses lasers equivalent to those used in Xijin scribing machines (Febon).

2. Linear platforms use well-known brands such as THK and Oriental Motor.

3. Warranty period of 3 years or more.

 

Functional Configuration

1. The scribing machine has a built-in graphic editing function, which is simple and convenient to operate, and can provide data input error prompts and parameter abnormality reminders.

2. Key parameters include access control to prevent misoperation.

 

Stability

The scribing machine has good stability. After successful debugging, the quality and process can be maintained stably for a long time, with basically no downtime under normal operation, and maintenance once can work for more than a month.

 

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