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Wafer Prober
Category:
Detailed introduction
The GPS1200 wafer probe station is a dedicated device for wafer probe testing. It can meet the testing needs of 12-inch and 8-inch wafers. Through a high-precision positioning platform, a high-rigidity wafer carrier, and high-resolution upward-looking camera (probe camera) and downward-looking camera (wafer camera), it realizes fully automatic wafer loading and unloading, probing, and high-precision needle insertion, cooperating with the tester to complete the quality inspection of integrated circuits on the wafer.
1. Main Indicators
|
Functional Indicators |
Wafer Diameter |
mm |
300/200 |
|
|
Maximum Probe Card Diameter |
mm |
500 |
||
|
Comprehensive Test Error |
μm |
≤±2.5 |
||
|
Chuck Load Capacity |
Kg |
200 |
||
|
Kg |
400 (Optional) |
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High Temperature Test |
Temperature Control Range |
℃ |
30-150 |
|
|
Temperature Control Accuracy |
℃ |
±2 |
||
|
Chuck High Temperature Deformation |
μm |
<20 |
||
|
Working Stroke |
X-axis |
mm |
350 |
|
|
Y-axis |
mm |
765 |
||
|
Z-axis |
mm |
35 |
||
|
θ-axis |
° |
±3.5 |
||
|
Accuracy Indicators |
X-axis |
μm |
±1 |
|
|
Y-axis |
μm |
±1 |
||
|
Z-axis |
μm |
±2 |
||
|
θ-axis |
″ |
±3 |
||
|
Speed Indicators |
X-axis |
mm/s |
100-400 |
|
|
Y-axis |
mm/s |
100-400 |
||
|
Z-axis |
mm/s |
1-20 |
||
|
θ-axis |
°/s |
1-5 |
||
|
Imaging System |
Wafer Camera |
Magnification |
1x/6x |
|
|
Probe Camera |
Magnification |
2x/12x |
||
|
Pre-alignment Camera |
Field of View |
40°x52° |
||
|
ID Camera |
Field of View |
24°x31° |
||
|
Control System |
Industrial PC |
With Image Acquisition Card |
2-port/4-port |
|
|
Controller |
Multi-axis Motion Control |
PMAC (8-axis) x2 |
||
|
Mechanical Parameters |
Detection Unit |
Length/Width/Height |
mm |
1775/1095/1005 (Alarm light 1410) |
|
Equipment Weight |
kg |
1750 |
||
|
Loading Unit |
Length/Width/Height |
mm |
1830/632/1617 (Alarm light 1920) |
|
|
Equipment Weight |
kg |
550 |
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2. Product Features
|
Item |
Performance Description |
Remarks |
|
Equipment Function |
Suitable for 12-inch and 8-inch wafer testing requirements in wafer fabs, fully automated from wafer loading to test completion, meeting the requirements of multi-chip testing and multi-parallel testing. |
|
|
Equipment Features |
1. High-precision closed-loop positioning platform. 2. CCD recognition automatic probing. 3. Dual robotic arm automatic loading and unloading. 4. Automatic card loading (optional). 5. Carrier high-temperature test control. 6. High-resolution imaging system. 7. Data storage and management system. 8. Full Chinese touch screen operation, clear interface. |
|
|
Functional Configuration |
1. Automatic loading and unloading of cassettes |
|
|
Operating Interface |
1. Full Chinese Interface. 2. Process Information Display Function. 3. Alarm Information Display Function. |
|
|
Security |
1. Multiple hardware and software safety switches ensure safe equipment operation. 2. Real-time alarm for malfunctions and exceptions. 3. Access control for key parameters 4. Key data discrimination and interception |
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|
External Interfaces |
1. GPIB 2. RS232 3. TTL |
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3. Conditions of Use
|
Item |
Description |
Remarks |
|
Ambient Temperature |
22℃±1 ℃ |
|
|
Relative Humidity |
50±15%RH |
|
|
Compressed Air |
Dry air without oil mist and moisture, ≥0.5Mpa |
|
|
Vacuum Supply |
≤-80Kpa |
|
|
Power Voltage |
Single-phase, AC 220V, 50HZ, 2.0KvA |
|
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Tel：
+86-431-81785047 13944133408
Email：
gh01@ghwdz.cn
ghgsjyb2004@163.com
Address：
No. 1188, Shengbei Street, Beihulei Science and Technology Development Zone, Changchun, Jilin Province
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